Applied Materials, Inc. and Ushio, Inc. announced a strategic partnership to accelerate the industry’s roadmap for heterogeneous integration (HI) of chiplets into 3D packages. The companies are jointly bringing to market the first digital lithography system specifically designed for patterning the advanced substrates needed in the Artificial Intelligence (AI) era of computing. Rapidly growing AI workloads are driving the need for larger chips with greater functionality. As the performance req...